首頁 邏輯和電壓轉換 電壓轉換器及電平移位器 電壓轉換器
首頁
邏輯和電壓轉換
電壓轉換器及電平移位器
電壓轉換器

TWL1200-Q1

現行
立即訂購
產品規格表

TWL1200-Q1

現行
產品規格表 立即訂購

產品詳細資料

Bits (#) 19 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction, Direction-controlled Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 1.1 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO, UART Audio Features Output enable Technology family TWL Supply current (max) (mA) 0.03 Rating Automotive Operating temperature range (°C) -40 to 85
Bits (#) 19 Data rate (max) (Mbps) 60 Topology Open drain, Push-Pull Direction control (typ) Auto-direction, Direction-controlled Vin (min) (V) 1.1 Vin (max) (V) 3.6 Vout (min) (V) 1.1 Vout (max) (V) 3.6 Applications MMC, SD Card, SDIO, UART Audio Features Output enable Technology family TWL Supply current (max) (mA) 0.03 Rating Automotive Operating temperature range (°C) -40 to 85
TQFP (PFB) 48 81 mm² (9 mm × 9 mm)
  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 3: –40°C to +85°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H1C
    • Device CDM ESD Classification Level C3B
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility Gap
    Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 3: –40°C to +85°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H1C
    • Device CDM ESD Classification Level C3B
  • Level Translator
    • VCCA and VCCB Range of 1.1 V to 3.6 V
  • Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility Gap
    Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II

The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.

The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.
filter 尋找其它 電壓轉換器
下載 觀看有字幕稿的影片 影片

技術文件

找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 5
重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 SDIO, UART, and Audio Voltage-Translation Transceiver, TWL1200-Q1 datasheet (Rev. A) 2012/4/28
應用說明 Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024/7/12
應用說明 Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024/7/3
選擇指南 Voltage Translation Buying Guide (Rev. A) 2021/4/15
更多文件說明 Automotive Logic Devices Brochure 2014/8/27

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 針腳 CAD 符號、佔位空間與 3D 模型
TQFP (PFB) 48 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片