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Texas Instruments Unveils World's Smallest Logic Devices Available For Portable Consumer Electronics
NanoStar™ package reduces size by 70 percent from SC-70 packages
DALLAS (June 18, 2001) -- Consumer portable electronics will benefit from a 70 percent reduction in size from the SC-70 (DCK) logic package size with the introduction of NanoStar(tm) packaging, announced today by Texas Instruments (TI) (NYSE: TXN). NanoStar packaging enables manufacturers to deliver the smaller size portable consumer electronics demanded by customers, while enhancing reliability and signal integrity. The first devices available in NanoStar packaging will offer the most popular logic functions for space-constrained systems such as wireless handsets, pagers, personal digital assistants, portable DVD players, MP3 players, notebook computers and other portable consumer electronics. (See www.ti.com/sc/nanostar)
NanoStar packaging will be first introduced in a 5-pin, Single-Gate, Low-Voltage CMOS (LVC) technology. LVC Dual Gate devices will follow in an 8-pin version. These Little Logic devices operate at 1.8-V, and are optimized at 3.3-V, providing low power consumption and medium current drive capability. These devices allow designers the ability to place more functions in a tighter space while improving system performance. As portable electronics continue to move towards the smaller form factors, TI delivers complete space saving solutions from its industry leading DSPs and high-performance analog products, to the all-new high-performance logic devices in NanoStar packaging.
"As the world leader in logic, TI continues to take the logic market into new areas by developing leading technologies and innovative products. The introduction of NanoStar packaging meets the industry demand for high-speed, low-power, single gate logic, while enabling smaller designs," said David Hoover, worldwide product marketing manager for TI's Standard Linear and Logic Products. "In addition to size, NanoStar packaging improves the overall system's signal integrity and reliability as customers design with lower power, higher performance DSPs and analog ICs."
With a footprint of 1.40mm by 0.9mm by 0.50mm = 1.26mm2, NanoStar packaging offers a 13 percent reduction in size from any other alternative logic package solution and a 70 percent reduction over TI's previous single gate package, SC-70. Designers will also realize improved thermal performance with the new NanoStar package over the SC-70. This improved thermal performance benefits designers concerned with heat dissipation common in small, portable electronics. NanoStar packaging is a leadless package option that makes use of five eutectic solder balls. With a ball pitch of 0.5mm, these self-planarizing balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.
Availability and pricing
The first products in NanoStar packaging are sampling now with volume production scheduled for the fourth quarter of 2001. Estimated resale pricing is $0.25 for quantities greater than 50,000 in 3,000 part reels. NanoStar packaging is fully supported with technical documentation including a NanoStar Packaging Design Summary and Little Logic Selection Guide located on-line at www.ti.com/sc/nanostar
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