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TI Introduces Industry's Fastest 3.3-V FIFO Devices Optimizing DSP Performance in High Bandwidth Telecom and Internetworking Applications
Devices Fully Optimize DSP Performance by Eliminating Data Bottlenecks
SHERMAN, TX (September 7, 2001) -- Telecommunications, broadband, optical networking, data network storage and video imaging applications will all benefit from the introduction of the industry's fastest 3.3-V DSP-Sync First-In, First-Out (FIFO) product family, announced today by Texas Instruments (TI) (NYSE: TXN). The new products increase the overall speed of a system and are designed to provide a glueless interface with TI's high-performance DSP product families. The new family offers the features necessary to enhance DSP-based system designs, leveraging TI's most advanced process technology to create the fastest 3.3-V FIFOs in the market, as well as setting new levels in cost efficiency.
(See http://www.ti.com/sc/fifo)
"As the performance of DSPs continues to improve, eliminating data bottlenecks in the system and fully utilizing the DSP become critical in designing for high bandwidth applications," said Al McHugh, WW FIFO Marketing Manager for TI's Advanced Logic Products. "This new family actually was developed in response to numerous consumer requests for increased efficiency and optimization in DSP-based systems. These new 3.3-V FIFO products actually prevent DSPs from being slowed down by constant interrupts from the peripherals, raising the performance of the entire system."
SN74V293 Supports Multi-Channel Applications
The high performance SN74V293 series DSP-Sync FIFOs offer low power (3.3 V Vcc), 3.0 Gbps data-rate performance (166 MHz max clock cycle frequency), and data access times of only 4.5 ns. The data input and output ports of these synchronous unidirectional FIFOs can be programmed as either 9-bits or 18-bits, with configurations as dense as 128Kx9 or 64Kx18. These DSP-Sync FIFOs are ideal for use in multi-channel applications that require buffering large amounts of data, such as wireless basestations, remote access servers (RAS), digital subscriber loop (xDSL) systems, network security camera systems, cable modems, advanced medical/industrial imaging applications, precision instrumentation, and multi-channel telephony systems.
In addition to the 9/18-bit SN74V293, TI plans to release the SN74V3690 series DSP-Sync FIFOs (32Kx36, 3.3 V Vcc, 166 MHz, 6.0 Gbps) during 2002. Offering the high bandwidth critical for both wired and wireless broadband communications infrastructure equipment, the SN74V3690 series will be ideal for use in Digital Subscriber Line Access Multiplexers (DSLAMs), 3G wireless basestations, as well as other data-intensive applications.
SN74V245 Optimizes High-Speed Data Acquisition
The SN74V245 series DSP-Sync FIFOs offer low power (3.3 V Vcc), 2.4 Gbps data-rate performance (133 MHz max clock cycle frequency), and data access times of only 5 ns. These synchronous unidirectional FIFOs are available with configurations as dense as 4Kx18. The SN74V245 series DSP-Sync FIFOs are ideal for use in high-speed data acquisition applications and data-intensive communications equipment, such as gigabit-Ethernet routers, ATM switches, wireless basestations, and SONET/ATM multiplexers.
Pricing and Availability
Samples of the SN74V293 are available now, with volume production planned for the third quarter of 2001. The SN74V293 series will be available in both the 80-pin TQFP (PZA) and 100-pin MicroStar BGA™ (GGM) packages with pricing starting at $19.50 per unit in quantities of 1,000.
Production volumes of the SN74V245 series DSP-Sync FIFOs are available now. The SN74V245 series are orderable in the 64-pin TQFP (PAG) package with pricing starting at $12.70 per unit in quantities of 1,000.
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Trademarks:
MicroStar BGA is a trademark
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