Thermal imaging camera

Thermal imaging camera system integrated circuits and reference designs


Thermal imaging cameras have features like low-light operation and immunity to visual limitations. These cameras demand compact designs, low-power consumption and light weight with high performance. Our integrated circuits and reference designs help you differentiate your next camera design with high image quality.

Thermal imaging camera designs often require:

  • Superior image quality with low noise and excellent linearity.
  • Ultra-low flicker noise to avoid frame-to-frame pattern noise.
  • Low-power consumption of analog front-end electronics to minimize background radiation interfering with external IR energy from scene.
  • Analog signal chain supports wide range of sensor resolution from QQVGA to XGA and both cooled and uncooled LWIR detectors.
View more

Technical documentation

Application notes & user guides

Application Notes (1)

Title Type Size (KB) Date
PDF 22.06 MB 02 Nov 2018

Product bulletin & white papers

White Papers (1)

Title Type Size (MB) Date
PDF 784 KB 23 May 2019

Technical articles

Support & training

TI E2E™ forums with technical support from TI engineers

Search our extensive online knowledge base where millions of technical questions and answers are available 24/7.

Search answers from TI experts

Content is provided 'AS IS' by the respective TI and Community contributors and does not constitute TI specifications.
See terms of use.

If you have questions about quality, packaging, or ordering TI products visit our Support page.