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SN74LVC1G175DBVR ACTIVE

Single D-Type Flip-Flop with Asynchronous Clear

Same as: 74LVC1G175DBVRE4, 74LVC1G175DBVRG4   This part number is identical to the part number listed above. You can only order quantities of the part number listed above.

US ECCN: EAR99 US/Local Export Classification Number

NEW - Custom reel may be available
Inventory: 1  
 

Quality information

RoHS Yes
REACH Yes
Lead finish / Ball material NIPDAU
MSL rating / Peak reflow Level-1-260C-UNLIM
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
View or download

Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (°C)
SOT-23 (DBV) | 6 3,000 | LARGE T&R
Custom reel may be available
-40 to 125
Package | Pins SOT-23 (DBV) | 6
Package qty | Carrier: 3,000 | LARGE T&R
Custom reel may be available
Operating temperature range (°C) -40 to 125
View TI packaging information

Features for the SN74LVC1G175

  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Max tpd of 4.3 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Description for the SN74LVC1G175

This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G175 device has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Pricing


Qty Price (USD)
1-99 0.095
100-249 0.065
250-999 0.05
1,000+ 0.033

Additional package qty | carrier options

Package qty | Carrier 250 | SMALL T&R
Inventory 50
Qty | Price (USD) 1ku | 0.212 1-99 0.524 100-249 0.403 250-999 0.297 1,000+ 0.212