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CC2564CRVMT ACTIVE

Bluetooth® 4.2 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)

Inventory: 249
 

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Packaging information

Package | Pins VQFNP-MR (RVM) | 76
Operating temperature range (℃) I (-40 to 85)
Package qty | Carrier: 250 | SMALL T&R
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Quality information

RoHS Yes
REACH Yes
Lead finish / Ball material SN
MSL rating / Peak reflow Level-3-260C-168 HR
Material content View
DPPM / MTBF / Fit rate View
Qualification summary View
Ongoing reliability monitoring View
Device marking View

Features

  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 4.2 Component Qualified (Declaration ID: D032801); Compliant up to the HCI Layer
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm (VQFNP-MR)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–Inter-IC Sound (I2S) Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • CC256x Bluetooth Hardware Evaluation Tool:
    PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

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Description

The TI CC2564C device is a complete Bluetooth® BR, EDR, and low energy HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 4.2 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with about twice the range of other Bluetooth low-energy solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications are supported including the following:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

Qty Price
1-99 $3.70
100-249 $3.24
250-999 $2.27
1,000+ $1.83

Alternative carriers

Part number CC2564CRVMR
Package qty | Carrier 2,500 | 
Inventory 17,077
Qty | Price (USD) 1ku | $1.59