CC256XQFNEM Dual-mode Bluetooth® CC2564 evaluation board angled board image

CC256XQFNEM

Dual-mode Bluetooth® CC2564 evaluation board

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Features for the CC256XQFNEM

  • CC2564B device (QFN package)
  • Bluetooth Specification v4.1
  • Dual Mode - Bluetooth & Bluetooth low energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (+12dBm)
  • High sensitivity (-93 dBm typ.)
  • UART Interface - Control and Data
  • PCM/I2S Interface - Voice and Audio
  • 4 Layer PCB design
  • 1.8 LDO (LP2985-18)
  • 3 Voltage level translators (SN74AVC4T774)
  • PCB antenna
  • EM connectors that plug directly into the TI hardware development kits:
    • MSP-EXP430F5529
    • MSP-EXP430F5438
    • DK-TM4C123G
    • DK-TM4C129X
  • COM connector
  • Certified and royalty-free TI Bluetooth Stack

Description for the CC256XQFNEM

The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and other MCUs. Moreover, a certified and royalty-free TI Bluetooth Stack is available for the MSP430 (CC256XMSPBTBLESW), TM4C12x MCUs (CC256XM4BTBLESW) and other MCUs (CC256XSTBTBLESW).

The CC256XQFNEM hardware design files (schematics, layout and BOM) are provided as a reference to aid in the implementation of the CC256x devices.

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