Packaging information
Package | Pins HTSSOP (PWP) | 20 |
Operating temperature range (°C) -40 to 150 |
Package qty | Carrier 2,500 | LARGE T&R |
Features for the LM5116
- New, similar products available:
- Emulated peak current mode
- Wide operating range up to 100 V
- Low I Q shutdown (< 10 µA)
- Drives standard or logic level MOSFETs
- Robust 3.5-A peak gate drive
- Free-run or synchronous operation to 1 MHz
- Optional diode emulation mode
- Programmable output from 1.215 V to 80 V
- Precision 1.5% voltage reference
- Programmable current limit
- Programmable soft start
- Programmable line undervoltage lockout
- Automatic switch to external bias supply
- HTSSOP-20 exposed pad
- Thermal shutdown
- Create a custom design using the LM5116 with the WEBENCH Power Designer
Description for the LM5116
The LM5116 is a synchronous buck controller intended for step-down regulator applications from a high-voltage or widely varying input supply. The control method is based upon current mode control using an emulated current ramp. Current mode control provides inherent line feed-forward, cycle-by-cycle current limiting, and ease-of-loop compensation. The use of an emulated control ramp reduces noise sensitivity of the pulse-width modulation circuit, allowing reliable control of very small duty cycles necessary in high-input voltage applications.
The operating frequency is programmable from 50 kHz to 1 MHz. The LM5116 drives external high-side and low-side NMOS power switches with adaptive dead-time control. A user-selectable diode emulation mode enables discontinuous mode operation, for improved efficiency at light load conditions. A low quiescent current shutdown disables the controller and consumes less than 10 µA of total input current.
Additional features include a high-voltage bias regulator, automatic switch-over to external bias for improved efficiency, thermal shutdown, frequency synchronization, cycle-by-cycle current limit, and adjustable line undervoltage lockout. The device is available in a power enhanced HTSSOP-20 package featuring an exposed die attach pad to aid thermal dissipation.
New products (LM5148 and LM5149) offer reduced BOM cost, higher efficiency, and reduced design size among many other features.