Packaging information
| Package | Pins B1QFN (RUQ) | 47 |
| Operating temperature range (°C) -40 to 85 |
| Package qty | Carrier 500 | LARGE T&R |
Features for the LMZ31503
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 15mm × 2.8mm package
- Pin Compatible with LMZ31506 - Efficiencies Up To 95%
- Wide-Output Voltage Adjust
0.8 V to 5.5 V, with 1% Reference Accuracy - Optional Split Power Rail
Allows
Input Voltage Down to 1.6 V - Adjustable Switching Frequency
(330 kHz to 780 kHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Overcurrent Protection (Hiccup-Mode)
- Over Temperature Protection
- Pre-bias Output Start-up
- Operating Temperature Range: –40°C to +85°C
- Enhanced Thermal Performance: 13°C/W
- Meets EN55022 Class B
Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ31503 With the WEBENCH® Power Designer
Description for the LMZ31503
The LMZ31503 power module is an easy-to-use integrated power solution that combines a 3-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics design process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with up to 95% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 3-A rated output current at 85°C ambient temperature without airflow.
The LMZ31503 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.