Packaging information
| Package | Pins B4QFN (RLG) | 72 |
| Operating temperature range (°C) -40 to 85 |
| Package qty | Carrier 250 | SMALL T&R |
Features for the LMZ31530
- Complete Integrated Power Solution;
Smaller than a Discrete Design - 15 mm × 16 mm × 5.8 mm Package Size
- Pin Compatible with LMZ31520 - Ultra-Fast Load Step Response
- Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.6 V to 3.6 V, with 1% Reference Accuracy - Optional Split Power Rails
Allows
Input Voltage Down to 3 V - Selectable Switching Frequency;
(300 kHz to 850 kHz) - Selectable Slow-Start
- Adjustable Over Current Limit
- Power Good Output
- Output Voltage Sequencing
- Over Temperature Protection
- Pre-bias Output Start-up
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 8.6°C/W
- Meets EN55022 Class A
Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ31530 With the WEBENCH® Power Designer
Description for the LMZ31530
The LMZ31530 power module is an easy-to-use integrated power solution that combines a 30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31530 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.