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Low-power, digital temperature sensor with SMAART Wire™ / UART interface

US ECCN: EAR99 US/Local Export Classification Number

Inventory: 2,990  
Limit:  50

Quality information

RoHS Yes
Lead finish / Ball material Call TI
MSL rating / Peak reflow Level-1-260C-UNLIM
Quality, reliability
& packaging information

Information included:

  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
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Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (°C)
PICOSTAR (YMT) | 4 3,000 | LARGE T&R
-40 to 125
Package | Pins PICOSTAR (YMT) | 4
Package qty | Carrier: 3,000 | LARGE T&R
Operating temperature range (°C) -40 to 125
View TI packaging information

Features for the TMP144

  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625 °C
  • ±1 °C maximum (–10 °C to +100 °C)
  • ±2 °C maximum (–40 °C to +125 °C)
  • Low quiescent current:
    • 3-µA active IQ at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)

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Description for the TMP144

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625 °C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40 °C to 125 °C and is available in two different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.


Qty Price (USD)
1-99 0.469
100-249 0.361
250-999 0.266
1,000+ 0.19