SM320F28335GJZMEP image

SM320F28335GJZMEP ACTIVE

C2000™ Enhanced Product 32-bit MCU with 150 MIPS, FPU, 512 KB Flash, EMIF, 12b ADC

Same as: V62/09624-01XE This part number is identical to the part number listed above. You can only order quantities of the part number listed above.

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Quality information

Rating HiRel Enhanced Product
RoHS No
REACH Affected
Lead finish / Ball material SNPB
MSL rating / Peak reflow Level-3-235C-168 HR
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish / Ball material
  • MSL rating / Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
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Additional manufacturing information

Information included:

  • Fab location
  • Assembly location
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Export classification

*For reference only

  • US ECCN: 3A001A2C

Packaging information

Package | Pins BGA (GJZ) | 176
Operating temperature range (°C) -55 to 125
Package qty | Carrier 126 | JEDEC TRAY (10+1)

Features for the SM320F28335-EP

  • High-Performance Static CMOS Technology
    • Up to 150 MHz (6.67-ns Cycle Time)
    • 1.9-V/1.8-V Core, 3.3-V I/O Design
  • High-Performance 32-Bit CPU
    • IEEE-754 Single-Precision Floating-Point Unit (FPU)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • Over 2M x 16 Address Reach
  • On-Chip Memory
    • 256K x 16 Flash, 34K x 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (8K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/RAM Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 18 PWM Outputs
    • Up to 6 HRPWM Outputs With 150 ps MEP Resolution
    • Up to 6 Event Capture Inputs
    • Up to 2 Quadrature Encoder Interfaces
    • Up to 8 32-bit/Nine 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • One SPI Module
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 80-ns Conversion Rate
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Internal or External Reference
  • Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
  • JTAG Boundary Scan Support(1)
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Support Includes
    • ANSI C/C++ Compiler/Assembler/Linker
    • Code Composer Studio IDE
    • DSP/BIOS
    • Digital Motor Control and Digital Power Software Libraries
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Quad Flatpack With Power-Pad (PTP)
    • Thin Quad Flatpack (PGF, Preview Only)
    • MicroStar BGA (GHH)
    • Plastic BGA (GJZ)
  • Temperature Options:
    • A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)
    • S: –40°C to 125°C (GJZ, Preview Only)
    • Q: –40°C to 125°C (GJZ, Preview Only)
    • M: –55°C to 125°C (PTP, GJZ)
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range(2)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
(2) Additional temperature ranges are available - contact factory

Description for the SM320F28335-EP

The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.

Throughout this document, the device is abbreviated as F28335. provides a summary of features.

Pricing

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Carrier options

You can choose different carrier options based on the quantity of parts, including full reel, custom reel, cut tape, tube or tray.

A custom reel is a continuous length of cut tape from one reel to maintain lot- and date-code traceability, built to the exact quantity requested. Following industry standards, a brass shim connects an 18-inch leader and trailer on both sides of the cut tape for direct feeding into automated assembly machines. TI includes a reeling fee for custom reel orders.

Cut tape is a length of tape cut from a reel. TI may fulfill orders using multiple strips of cut tapes or boxes to satisfy the quantity requested.

TI often ships tube or tray devices inside a box or in the tube or tray, depending on inventory availability. We pack all tapes, tubes or sample boxes according to internal electrostatic discharge and moisture-sensitivity-level protection requirements.

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Lot and date code selection may be available

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