Packaging information
| Package | Pins TSSOP (DGG) | 56 |
| Operating temperature range (°C) -40 to 85 |
| Package qty | Carrier 35 | TUBE |
Features for the SN65HVD09
- Designed to Operate at up to 20 Million Data Transfers per Second on Each RS-422/RS-485 Channel
- SN65HVD09 Packaged in Thin Shrink Small-Outline Package with 0.5-mm Pin Pitch
- ESD Protection on Bus Pins Exceeds 12kV
- Low Disabled Supply Current 8 mA Typ
- Thermal Shutdown Protection
- Positive- and Negative-Current Limiting
- Power-Up/Down Glitch Protection
Description for the SN65HVD09
The SN65HVD09 is a 9-channel RS-422 / RS-485 transceiver suitable for industrial applications. It offers improved switching performance, a small package, and high ESD protection. The precise skew limits ensures that the propagation delay times, not only from channel-to-channel but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel data buses.
Patented thermal enhancements are used in the thin shrink, small-outline package (TSSOP), allowing operation over the industrial temperature range. The TSSOP package offers very small board area requirements while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives.
The HVD09 can withstand electrostatic discharges exceeding 12 kV using the human-body model, and 600 V using the machine model on the RS-485 I/O terminals. This provides protection from the noise that can be coupled into external cables. The other terminals of the device can withstand discharges exceeding 4 kV and 400 V respectively.
Each of the nine half-duplex channels of the HVD09 is designed to operate with either RS-422 or RS-485 communication networks.
The SN65HVD09 is characterized for operation over an ambient air temperature range of -40°C to 85°C.