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SN74AUP3G07DCUR ACTIVE

Low-Power Triple Inverter Buffer/Driver With Open-Drain Outputs

NEW - Custom reel may be available
Inventory: 67,292
 

Quality information

RoHS Yes
REACH Yes
Lead finish / Ball material NIPDAU
MSL rating / Peak reflow Level-1-260C-UNLIM
Material content View
DPPM / MTBF / Fit rate View
Qualification summary View
Ongoing reliability monitoring View
Device marking View

Packaging information

Package | Pins Package qty | Carrier Operating temperature range (°C)
VSSOP (DCU) | 8 3,000 | LARGE T&R
Custom reel may be available
I (-40 to 85)
Package | Pins VSSOP (DCU) | 8
Package qty | Carrier 3,000 | LARGE T&R
Custom reel may be available
Operating temperature range (°C) I (-40 to 85)
View TI packaging information

Features for the SN74AUP3G07

  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

Description for the SN74AUP3G07

The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.

The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Pricing


Qty Price (USD)
1-99 $0.347
100-249 $0.236
250-999 $0.182
1,000+ $0.121