Packaging information
| Package | Pins X2SON (DSF) | 6 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 5,000 | LARGE T&R |
Features for the SN74LVC2G07
- Dual Open-Drain Buffer Configuration
- -24-mA Output Drive at 3.3 V
- Support Translation-Up and Down
- Available in the Texas Instruments
NanoFree™ Package - Supports 5-V VCC Operation
- Inputs and Open-Drain Outputs Accept Voltages
Up to 5.5 V - Max tpd of 3.7 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection - Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Description for the SN74LVC2G07
This dual buffer and driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.