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SN74LVC2G17DBVR ACTIVE

2-ch, 1.65-V to 5.5-V buffers with Schmitt-Trigger inputs

US ECCN: EAR99 US/Local Export Classification Number

NEW - Custom reel may be available
Inventory: 357,503  
 

Quality information

RoHS Yes
REACH Yes
Lead finish / Ball material SN, NIPDAU
MSL rating / Peak reflow Level-1-260C-UNLIM
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
View or download

Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (°C)
SOT-23 (DBV) | 6 3,000 | LARGE T&R
Custom reel may be available
-40 to 125
Package | Pins SOT-23 (DBV) | 6
Package qty | Carrier: 3,000 | LARGE T&R
Custom reel may be available
Operating temperature range (°C) -40 to 125
View TI packaging information

Features for the SN74LVC2G17

  • Schmitt-Trigger inputs provide hysteresis
  • Available in the Texas Instruments NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode
    Operation and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78,
    Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model

Description for the SN74LVC2G17

This dual Schmitt-Trigger buffer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G17 device contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Pricing


Qty Price (USD)
1-99 0.144
100-249 0.098
250-999 0.075
1,000+ 0.05

Additional package qty | carrier options

Package qty | Carrier 250 | SMALL T&R
Inventory 159,053
Qty | Price (USD) 1ku | 0.313 1-99 0.773 100-249 0.595 250-999 0.438 1,000+ 0.313