Packaging information
| Package | Pins TSSOP (PW) | 20 |
| Operating temperature range (°C) -40 to 85 |
| Package qty | Carrier 2,000 | LARGE T&R |
Features for the SN74LVT574
- State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static Power Dissipation
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Support Unregulated Battery Operation Down to 2.7 V
- Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model(C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
- Support Live Insertion
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic (J) DIPs
Description for the SN74LVT574
These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The eight flip-flops of the ´LVT574 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable 
input can be used to place the eight outputs in either a normal logic
state (high or low logic levels) or a high-impedance state. In the
high-impedance state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and increased drive
provide the capability to drive bus lines without need for interface
or pullup components.
does
not affect the internal operations of the flip-flops. Old data can be
retained or new data can be entered while the outputs are in the
high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down,
should be tied
to VCC through a pullup resistor; the minimum value of the
resistor is determined by the current-sinking capability of the
driver.
The SN74LVT574 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVT574 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT574 is characterized for operation from -40°C to 85°C.