538-pin (CBD) package image

TDA2EGBHQCBDRQ1 ACTIVE

SoC processors with graphics and video acceleration for ADAS applications (17mm package)

ACTIVE custom-reels CUSTOM Custom reel may be available

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Export classification

*For reference only

  • US ECCN: 5A992C

Packaging information

Package | Pins FCCSP (CBD) | 538
Operating temperature range (°C) -40 to 125
Package qty | Carrier 750 | LARGE T&R

Features for the TDA2EG-17

  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video input and video output
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • DDR3/DDR3L Memory Interface (EMIF) module
    • Supports up to DDR-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller With DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR™ SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-port gigabit ethernet (GMAC)
    • Up to two external ports
  • Sixteen 32-bit general-purpose timers
  • 32-Bit MPU watchdog timer
  • Six high-speed inter-integrated circuit (I2C) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI Interface (QSPI)
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High-speed USB 2.0 dual-role device
  • High-speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
  • PCI Express® 3.0 port with integrated PHY
    • One 2-lane Gen2-compliant port
    • or Two 1-lane Gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® CSI-2 camera serial interface
  • Up to 186 General-Purpose I/O (GPIO) pins
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 17 mm × 17 mm, 0.65-mm pitch, 538-pin BGA (CBD)

Description for the TDA2EG-17

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore™ and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm Cortex-A15 MPCore and dual-Cortex-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

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Carrier options

You can choose different carrier options based on the quantity of parts, including full reel, custom reel, cut tape, tube or tray.

A custom reel is a continuous length of cut tape from one reel to maintain lot- and date-code traceability, built to the exact quantity requested. Following industry standards, a brass shim connects an 18-inch leader and trailer on both sides of the cut tape for direct feeding into automated assembly machines. TI includes a reeling fee for custom reel orders.

Cut tape is a length of tape cut from a reel. TI may fulfill orders using multiple strips of cut tapes or boxes to satisfy the quantity requested.

TI often ships tube or tray devices inside a box or in the tube or tray, depending on inventory availability. We pack all tapes, tubes or sample boxes according to internal electrostatic discharge and moisture-sensitivity-level protection requirements.

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