Packaging information
| Package | Pins VSSOP (DGK) | 8 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 2,500 | LARGE T&R |
Features for the TLV2313-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the
Following Results
- Device Temperature Grade 1: –40°C to +125°C
Ambient Operating Temperature Range - Device HBM ESD Classification Level 3A
- Device CDM ESD Classification Level C6
- Device Temperature Grade 1: –40°C to +125°C
- Precision Amplifier for Cost-Sensitive Systems
- Low IQ: 65 µA/ch
- Wide Supply Range: 1.8 V to 5.5 V
- Low Noise: 26 nV/√Hz at 1 kHz
- Gain Bandwidth: 1 MHz
- Rail-to-Rail Input/Output
- Low Input Bias Current: 1 pA
- Low Offset Voltage: 0.75 mV
- Unity-Gain Stable
- Internal RFI/EMI Filter
Description for the TLV2313-Q1
The TLVx313-Q1 family of single- and dual-channel operational amplifiers combine low power consumption with good performance. This makes them designed for a wide range of applications, such as infotainment, engine control units, automotive lighting and more. The family features rail-to-rail input and output (RRIO) swings, low quiescent current (65 µA, typical), wide bandwidth (1 MHz) and very low noise (26 nV/√Hz at 1 kHz), making them attractive for a variety of battery-powered applications that require a good balance between cost and performance. Further, low-input-bias current enables these devices to be used in applications with megaohm source impedances.
The robust design of the TLVx313-Q1 devices provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 100 pF, integrated RFI/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).
The devices are optimized for operation at voltages as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C.
The single-channel TLV313-Q1 device is available in an SC70-5 package.The dual-channel TLV2313-Q1 device is offered in SOIC-8 (D) and VSSOP-8 (DGK) packages.