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TLV9002SIRUGR

2-Channel, 1MHz, RRIO, 1.8V to 5.5V Operational Amplifier for Cost-Optimized Systems

Packaging

Package | PIN: X2QFN (RUG) | 10
Temp: Q (-40 to 125)
Carrier: Cut Tape
Qty Price
1-9 $0.74
10-24 $0.65
25-99 $0.59
100-249 $0.50
250-499 $0.46
500-749 $0.35
750-999 $0.27
1000+ $0.23

Features

  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4 mV
  • Unity-gain bandwidth: 1 MHz
  • Low broadband noise: 27 nV/√Hz
  • Low input bias current: 5 pA
  • Low quiescent current: 60 µA/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8 V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Extended temperature range: –40°C to 125°C

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Texas Instruments  TLV9002SIRUGR

The TLV900x familyincludes single (TLV9001),dual (TLV9002), and quad-channel(TLV9004) low-voltage(1.8 V to 5.5 V)operational amplifiers (op amps) with rail-to-rail input and outputswing capabilities. These op amps provide a cost-effective solution for space-constrainedapplications such as smoke detectors, wearable electronics, and smallappliances where low-voltage operation and high capacitive-load drive are required. Thecapacitive-load drive of the TLV900x family is 500 pF, and the resistive open-loop output impedancemakes stabilization easier with much higher capacitive loads. These op amps are designedspecifically for low-voltage operation (1.8 V to 5.5 V) with performance specifications similar to theTLV600x devices.

The robust design of the TLV900x family simplifies circuit design. The op amps feature unity-gainstability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdriveconditions.

The TLV900x devices include a shutdown mode (TLV9001S, TLV9002Sand TLV9004S) that allow the amplifiers to switch off into standby mode with typical currentconsumption less than 1 µA.

Micro-size packages, such as SOT-553 and WSON, are offered for allchannel variants (single, dual, and quad), along with industry-standard packages such as SOIC, MSOP, SOT-23, and TSSOPpackages.