Packaging information
| Package | Pins TSSOP (PW) | 14 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 2,000 | LARGE T&R |
Features for the TLV9044
- Low power CMOS amplifier for cost-optimized applications
- Operational from supply voltage as low as 1.2 V
- Low input bias current: 1-pA typical, 12-pA maximum
- Low quiescent current: 10 µA/ch
- Low integrated noise of 6.5 µVp-p in 0.1 Hz – 10 Hz
- Rail-to-rail input and output
- High gain bandwidth product: 350 kHz
- Thermal noise floor: 64 nV/√Hz
- Low input offset voltage: ±0.6 mV
- Unity-gain stable
- Robustly drives 100 pF of load capacitance
- Internal RFI and EMI filtered input pins
- Wide specified temperature range: –40°C to 125°C
Description for the TLV9044
The low-power TLV904x family includes single (TLV9041), dual (TLV9042), and quad-channel (TLV9044) ultra-low-voltage (1.2 V to 5.5 V) operational amplifiers (op-amps) with rail-to-rail input and output swing capabilities. The TLV904x enables power savings both with its low quiescent current (10 µA, typ.) and the ability to operate at supply voltages as low as 1.2 V, making it one of the few amplifiers in the industry capable of 1.5-V coin cell applications. Further power savings can be achieved using the shutdown mode (TLV9041S, TLV9042S, and TLV9044S) that allows the amplifiers to be switched off and enter into a standby mode with typical current consumption of less than 150 nA. These devices offer a cost-effective amplifier solution for power and space-constrained applications such as battery-powered IoT devices, wearable electronics, and personal electronics where low-voltage operation is crucial.
The robust design of the TLV904x family simplifies circuit design. These op-amps feature an integrated RFI and EMI rejection filter, unity-gain stability, and no-phase reversal in input overdrive conditions. The device also delivers excellent AC performance with a gain bandwidth of 350 kHz and a high cap load drive of 100 pF, enabling designers to achieve both improved performance and lower power consumption.
Space-saving micro-size packages, such as X2QFN and WSON, are offered for all channel variants (single, dual, and quad), along with industry-standard packages such as SOIC, VSSOP, TSSOP, and SOT-23 packages.