Features for the TPD2S703Q1EVM
- IEC 61000-4-2 compliance testing
- USB pass-through functionality
- S-parameter measurement configuration
- Both DGS and DSK package types for evaluation
Description for the TPD2S703Q1EVM
The TI TPD2S703-Q1 allows users to protect the data lines of their USB interface in a small, easily-routed package. The TPD2S703-Q1 evaluation module (EVM) offers five varieties of the TPD2S703-Q1 that showcase multiple package options in different configurations to allow the user to test it however they prefer. The TPD2S703Q1EVM offers both a DGS and DSK package option in a pass-through configuration for system-level testing, as well as with SMA connectors to measure S-parameters. The EVM also offers a configuration with strike points to measure the response to an ESD impulse. Finally, the EVM offers blank traces to give a baseline while testing.