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Radiation-hardness-assured (RHA), 3-V to 7-V input, 6-A synchronous step-down converter

US ECCN: EAR99 US/Local Export Classification Number

Inventory: 7,769  

Quality information

RoHS Yes
Lead finish / Ball material AU
MSL rating / Peak reflow N/A for Pkg Type
Quality, reliability
& packaging information

Information included:

  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
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Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (°C)
CFP (HKH) | 20 1 | TUBE
25 to 25
Package | Pins CFP (HKH) | 20
Package qty | Carrier: 1 | TUBE
Operating temperature range (°C) 25 to 25
View TI packaging information

Features for the TPS50601A-SP

  • 5962-10221:
    • Radiation hardened up to TID 100krad(Si)
    • ELDRS free 100 krad(Si) – 10 mrad(Si)/s
    • Singlelhup (SEL) Immune to
      LET = 75 MeV-cm2/mg
    • SEB and SEGR immuneto 75 MeV-cm2/mg, SOA Curve Available
    • SET/SEFICross-section plot available
  • peak efficiency: 96.6% (VO = 3.3 V)
  • Integrated 58-mΩ/50-mΩ MOSFETs
  • Power rail: 3 to 7 V on VIN
  • 6-A Maximum output current
  • Flexible switching frequency options:
    • 100-kHz to 1-MHz Adjustable internaloscillator
    • External sync capability: 100 kHz to 1 MHz
    • Syncpin can be configured as a 500-kHz output for master/slaveapplications
  • 0.804-V ±1.5% Voltage reference overtemperature, radiation, and line and load regulation
  • Monotonic start-up into prebiased outputs
  • Adjustable soft start through external capacitor
  • Input enable and power-good output for power sequencing
  • Power good output monitor for undervoltage and overvoltage
  • Adjustable input undervoltage lockout (UVLO)
  • 20-Pin Ultra-small, thermally-enhanced ceramic flatpack package (hkh) for space applications

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Description for the TPS50601A-SP

TheTPS50601A-SP is a radiation hardened, 7-V, 6-A synchronous step-down converter, which isoptimized for small designs through high efficiency and integrating the high-side and low-sideMOSFETs. Further space savings are achieved through current mode control, which reduces componentcount, and a high switching frequency, reducing the inductor’s footprint. The devices are offeredin an ultra small, thermally enhanced 20-pin ceramic flatpack package.

The output voltage startup ramp is controlled by the SS/TR pin which allows operation aseither a stand alone power supply or in tracking situations. Power sequencing is also possible bycorrectly configuring the enable and the open drain power good pins. In addition, the TPS50601A-SPcan be configured in master-slave mode to provide up to 12-A of output current.

Cycle-by-cycle current limiting on the high-side FET protects the device in overloadsituations and is enhanced by a low-side sourcing current limit which prevents current runaway.There is also a low-side sinking current limit which turns off the low-side MOSFET to preventexcessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermalshutdown temperature.


Qty Price (USD)
1-9 1071.576
10-99 982.278
100+ 892.98