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36-V, 4-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRodâ„¢ QFN with simple footprint

US ECCN: EAR99 US/Local Export Classification Number

Quality information

RoHS Yes
Lead finish / Ball material NIPDAU
MSL rating / Peak reflow Level-3-245C-168 HR
Quality, reliability
& packaging information

Information included:

  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
View or download

Packaging information

Package | Pins Package qty | Carrier: Operating temperature range (°C)
B3QFN (RDA) | 15 1,000 | LARGE T&R -40 to 125
Package | Pins B3QFN (RDA) | 15
Package qty | Carrier: 1,000 | LARGE T&R
Operating temperature range (°C) -40 to 125
View TI packaging information

Features for the TPSM53604

  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: Meets CISPR11 radiated emissions
    • Excellent thermal performance: Up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design

Description for the TPSM53604

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.


Qty Price (USD)
1-99 4.392
100-249 3.837
250-999 2.958
1,000+ 2.646