Packaging information
| Package | Pins SOT-23 (DBV) | 6 |
| Operating temperature range (°C) -40 to 85 |
| Package qty | Carrier 3,000 | LARGE T&R |
Features for the TXB0101
- Available in the Texas Instruments NanoFree™ package
- 1.2 V to 3.6 V on A port and 1.65 V to 5.5 V on B port (VCCA ≤ VCCB)
- VCC isolation feature – if either VCC input is at GND, all outputs are in the high-impedance state
- OE input circuit referenced to VCCA
- Low power consumption, 5 µA maximum ICC
- Ioff supports partial-power-down mode operation
- Latch-up performance exceeds 100 mA Per JESD 78, class II
- ESD protection Exceeds JESD 22
- A port
- 2000 V Human body model (A114-B)
- 250 V Machine model (A115-A)
- 1500 V Charged-device model (C101)
- B port
- 15 kV Human body model (A114-B)
- 250 V Machine model (A115-A)
- 1500 V Charged-device model (C101)
- A port
Description for the TXB0101
This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.