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Gateway & vehicle compute application processor

Inventory: 83
Limit:  50

Quality information

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Packaging information

Package | Pins Package qty | Carrier Operating temperature range (°C)
FCBGA (ALF) | 827 44 | JEDEC TRAY (5+1)
-40 to 125
Package | Pins FCBGA (ALF) | 827
Package qty | Carrier 44 | JEDEC TRAY (5+1)
Operating temperature range (°C) -40 to 125
View TI packaging information

Features for the DRA829V

  • Processor cores:
  • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0 GHz, 24K DMIPS
    • 1MB shared L2 cache per dual-core Arm® Cortex®-A72 cluster
    • 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 Core
  • Four Arm® Cortex®-R5F MCUs at up to 1.0 GHz, 8K DMIPS
    • 64K L2 RAM per core memory
  • Memory subsystem:
  • 2MB of on-chip L3 RAM with ECC and coherency
    • ECC error protection
    • Shared coherent cache
    • Supports internal DMA engine
  • External Memory Interface (EMIF) module with ECC
    • Supports LPDDR4 memory types
    • Supports speeds up to 3733 MT/s
    • 32-bit data bus with inline ECC up to 14.9GB/s
  • General-Purpose Memory Controller (GPMC)
  • 512KB on-chip SRAM in MAIN domain, protected by ECC
  • Safety: targeted to meet ASIL-C for MCU island and ASIL-B for main processor
  • Integrated MCU island subsystem of Dual Arm® Cortex®-R5F cores with floating point coprocessor and optional lockstep operation, targeted to meet ASIL-C safety requirements/certification
    • 512B Scratchpad RAM memory
    • Up to 1MB on-chip RAM with ECC dedicated for R5F
    • Integrated Arm® Cortex®-R5F MCU island isolated on separate voltage and clock domains
      • Dedicated memory and interfaces capable of being isolated from the largerSoC
  • The DRA829 main processor is targeted to meet ASIL-B safety requirements/certification
    • Widespread ECC protection of on-chip memory and interconnect
    • Built-in self-test (BIST) and fault-injection for CPU and on-chip RAM
    • Error Signaling Module (ESM) with error pin
    • Runtime safety diagnostics, voltage, temperature, and clock monitoring, windowed watchdog timers, CRC engine for memory integrity checks
    • Safety documentation available for applications required to meet ISO 26262 requirements
  • Capture subsystem:
  • Two CSI2.0 4L RX plus one CSI2.0 4L TX
  • Display subsystem:
  • One eDP/DP interface with Multi-Display Support (MST)
    • HDCP1.4/HDCP2.2 high-bandwidth digital content protection
  • One DSI TX (up to 2.5K)
  • Up to two DPI
  • Device security:
  • Secure boot with secure runtime support
  • Customer programmable root key, up to RSA-4K or ECC-512
  • Embedded hardware security module
  • Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES
  • High speed serial interfaces:
  • Integrated ethernet switch supporting
    (total of 8 external ports)
    • Up to eight 2.5Gb SGMII
    • Up to eight RMII (10/100) or RGMII (10/100/1000)
    • Up to two QSGMII
  • Up to four PCI-Express® (PCIe) Gen3 controllers
    • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
    • Up to two lanes per controller
  • Two USB 3.0 dual-role device (DRD) subsystem
    • Two enhanced SuperSpeed Gen1 ports
    • Each port supports Type-C switching
    • Each port independently configurable as USB host, USB peripheral, or USB DRD
  • Automotive interfaces:
  • Sixteen Modular Controller Area Network (MCAN) modules with full CAN-FD support
  • Audio interfaces:
  • Twelve Multichannel Audio Serial Port (MCASP) modules
  • Flash memory interfaces:
  • Embedded MultiMediaCard interface (eMMC™ 5.1)
  • Universal Flash Storage (UFS 2.1) interface with two lanes
  • Two Secure Digital® 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
  • Two simultaneous flash interfaces configured as
    • One OSPI and one QSPI flash interfaces
    • or HyperBus™ and QSPI flash interface
  • System-on-Chip (SoC) architecture:
  • 16-nm FinFET technology
  • 24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA (ALF), enables IPC class 3 PCB routing
  • TPS6594-Q1 Companion Power Management ICs (PMIC):
  • Functional Safety support up to ASIL-D
  • Flexible mapping to support different use cases

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Description for the DRA829V

Jacinto™ 7 DRA829V automotive processors, based on the Arm®v8 64-bit architecture, provide advanced system integration to enable lower system costs of automotive applications such as Gateway, Vehicle Compute, and Body Domain Controller. The integrated diagnostics and functional safety features are targeted to ASIL-B/C certification/requirements. The integrated microcontroller (MCU) island eliminates the need for an external system MCU. The device features a Gigabit Ethernet switch and a PCIe® hub which enables networking use cases that require heavy data bandwidth. Up to four Arm® Cortex®-R5F subsystems manage low level, timing critical processing tasks leaving the Arm® Cortex®-A72’s unencumbered for applications. A dual-core cluster configuration of Arm® Cortex®-A72 facilitates multi-OS applications with minimal need for a software hypervisor.


Qty Price (USD)
1-99 129.01
100-249 125.13
250-999 104.178
1,000+ 97.0