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Dual-Channel Square/Sine-to-Square Wave Clock Buffer


Package | PIN: YFP | 8
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $1.63
10-24 $1.46
25-99 $1.36
100-249 $1.18
250-499 $1.09
500-749 $0.92
750-999 $0.75
1000+ $0.69


  • Low Additive Noise:
    • –149 dBc/Hz at10-kHz Offset Phase Noise
    • 0.37 ps (RMS) OutputJitter
  • Limited Output Slew Rate for EMI Reduction
    (1- to 5-ns Rise/Fall Time for 10-pF to 50-pF Loads)
  • Adaptive Output Stage Controls Reflection
  • Regulated 1.8-V Externally Available I/O Supply
  • Ultra-Small 8-bump YFP 0.4-mm Pitch WCSP
    (0.8 mm × 1.6 mm)
  • ESD Performance Exceeds JESD 22
    • 2000-V Human-Body Model(A114-A)
    • 1000-V Charged-Device Model
      (JESD22-C101-A Level III)

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Texas Instruments  CDC3RL02BYFPR

The CDC3RL02 is a two-channel clock fan-out buffer and is ideal for use in portableend-equipment, such as mobile phones, that require clock buffering with minimal additive phasenoise and fan-out capabilities. It buffers a single master clock, such as a temperature compensatedcrystal oscillator (TCXO) to multiple peripherals. The device has two clock request inputs(CLK_REQ1 and CLK_REQ2), each of which enable a single clock output.

The CDC3RL02 accepts square or sine waves at the master clock input (MCLK_IN),eliminating the need for an AC coupling capacitor. The smallest acceptable sine wave is a 0.3-Vsignal (peak-to-peak). CDC3RL02 has been designed to offer minimal channel-to-channel skew,additive output jitter, and additive phase noise. The adaptive clock output buffers offercontrolled slew-rate over a wide capacitive loading range which minimizes EMI emissions, maintainssignal integrity, and minimizes ringing caused by signal reflections on the clock distributionlines.

The CDC3RL02 has an integrated Low-Drop-Out (LDO) voltage regulator which accepts inputvoltages from 2.3 V to 5.5 V and outputs 1.8 V, 50 mA. This 1.8-V supply is externally available toprovide regulated power to peripheral devices such as a TCXO.

The CDC3RL02 is offered in a 0.4-mm pitch wafer-level chip-scale (WCSP) package (0.8 mm ×1.6 mm) and is optimized for very low standby current consumption.