CSD95379Q3M

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CSD95379Q3M

Synchronous Buck NexFET Power Stage, CSD95379Q3M

Packaging

Package | PIN: DNS | 10
Temp: S (-40 to 150)
Carrier: Cut Tape
Qty Price
1-9 $1.41
10-24 $1.26
25-99 $1.17
100-249 $1.02
250-499 $0.94
500-749 $0.79
750-999 $0.65
1000+ $0.59

Features

  • 92.5% System Efficiency at 12 A
  • Ultra-Low Power Loss of 1.8 W at 12 A
  • Max Rated Continuous Current of 20 A and Peak Current of 45 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.3-mm × 3.3-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Low Quiescent (LQ) and Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

Texas Instruments  CSD95379Q3M

The CSD95379Q3M NexFET™ power stage is a highly optimized design for use in high-power, high-density synchronous buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.3-mm × 3.3-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.