LMZ30606RKGT

text.skipToContent text.skipToNavigation

LMZ30606RKGT

2.95V to 6V, 6A Step-Down Power Module in 9x11x2.8mm QFN Package

Packaging

Package | PIN: RKG | 39
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $7.49
10-24 $6.96
25-99 $6.72
100-249 $5.87
250-499 $5.59
500-749 $5.14
750-999 $4.62
1000+ $4.60

Features

  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9mm x 11mm x 2.8mm package
    - Pin Compatible with LMZ30602 & LMZ30604
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30606 With the WEBENCH® Power Designer

All trademarks are the property of their respective owners.

Texas Instruments  LMZ30606RKGT

The LMZ30606 SIMPLE SWITCHER® power module is an easy-to-use integrated power solutionthat combines a 6-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into alow profile, QFN package. This total power solution requires as few as 3 external components andeliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows acompact point-of-load design with greater than 90% efficiency and excellent power dissipation witha thermal impedance of 12°C/W junction to ambient. The device delivers the full 6-A rated outputcurrent at 85°C ambient temperature without airflow.

The LMZ30606 offers the flexibility and the feature-set of a discrete point-of-loaddesign and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford arobust and reliable power solution compatible with standard QFN mounting and testingtechniques.