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3V to 14.5V, 30A Step-Down Power Module in 15x16x5.8mm QFN Package


Package | PIN: RLG | 72
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $21.56
10-24 $20.16
25-99 $19.52
100-249 $17.35
250-499 $17.23
500-749 $16.21
750-999 $14.55
1000+ $14.50


  • Complete Integrated Power Solution;
    Smaller than a Discrete Design
  • 15 mm × 16 mm × 5.8 mm Package Size
    - Pin Compatible with LMZ31520
  • Ultra-Fast Load Step Response
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.6 V to 3.6 V, with 1% Reference Accuracy
  • Optional Split Power Rails Allows
    Input Voltage Down to 3 V
  • Selectable Switching Frequency;
    (300 kHz to 850 kHz)
  • Selectable Slow-Start
  • Adjustable Over Current Limit
  • Power Good Output
  • Output Voltage Sequencing
  • Over Temperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 8.6°C/W
  • Meets EN55022 Class A Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31530 With the WEBENCH® Power Designer

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Texas Instruments  LMZ31530RLGT

The LMZ31530 power module is an easy-to-use integrated power solution that combines a30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFNpackage. This total power solution allows as few as three external components and eliminates theloop compensation and magnetics part selection process.

The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board andallows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast loadstep response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. TheLMZ31530 offers the flexibility and the feature-set of a discrete point-of-load design and is idealfor powering a wide range of ICs and systems. Advanced packaging technology affords a robust andreliable power solution compatible with standard QFN mounting and testing techniques.