LMZ31704RVQT

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LMZ31704RVQT

2.95V to 17V, 4A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package

Packaging

Package | PIN: RVQ | 42
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $7.96
10-24 $7.40
25-99 $7.14
100-249 $6.24
250-499 $5.94
500-749 $5.46
750-999 $4.90
1000+ $4.89

Features

  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 10 mm × 10 mm × 4.3 mm package
    • Pin Compatible with LMZ31710 &LMZ31707
  • Efficiencies Up To 95%
  • Eco-mode™ / Light Load Efficiency (LLE)
  • Wide-Output Voltage Adjust
    0.6 V to 5.5 V, with 1% Reference Accuracy
  • Supports Parallel Operation for Higher Current
  • Optional Split Power Rail Allows
    Input Voltages Down to 2.95 V
  • Adjustable Switching Frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an External Clock
  • Provides 180° out-of-phase Clock Signal
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Overcurrent and Overtemperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 13.3°C/W
  • Meets EN55022 Class B Emissions
    • Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31704 With the WEBENCH® Power Designer

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Texas Instruments  LMZ31704RVQT

The LMZ31704 power module is an easy-to-use integrated power solution that combines a 4-ADC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFNpackage. This total power solution allows as few as three external components and eliminates theloop compensation and magnetics part selection process.

The 10x10x4.3 mm QFN package is easy to solder onto a printed circuit board and allows acompact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipationcapability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibility and thefeature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs andsystems. Advanced packaging technology affords a robust and reliable power solution compatible withstandard QFN mounting and testing techniques.