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2.95V to 17V, 4A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package


Package | PIN: B3QFN (RVQ) | 42
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $7.96
10-24 $7.40
25-99 $7.14
100-249 $6.24
250-499 $5.94
500-749 $5.46
750-999 $4.90
1000+ $4.89


  • Complete integrated power solution allows
    small footprint, low-profile design
  • 10 mm × 10 mm × 4.3 mm package
    • Pin compatible with LMZ31710 and LMZ31707
  • Efficiencies up to 95%
  • Eco-mode™ / light load efficiency (LLE)
  • Wide-output voltage adjust
    0.6 V to 5.5 V, with 1% reference accuracy
  • Supports parallel operation for higher current
  • Optional split power rail allows
    input voltages down to 2.95 V
  • Adjustable switching frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an external clock
  • Provides 180° out-of-phase clock signal
  • Adjustable slow start
  • Output voltage sequencing / tracking
  • Power good output
  • Programmable undervoltage lockout (UVLO)
  • Overcurrent and overtemperature protection
  • Pre-bias output start-up
  • Operating temperature range: –40°C to 85°C
  • Enhanced thermal performance: 13.3°C/W
  • Meets EN55022 Class B emissions
    • Integrated shielded inductor
  • Create a custom design using the LMZ31704 with the WEBENCH® Power Designer

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Texas Instruments  LMZ31704RVQT

The LMZ31704 power module is an easy-to-use integrated power solution that combines a 4-ADC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFNpackage. This total power solution allows as few as three external components and eliminates theloop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board andallows a compact point-of-load design. Achieves greater than 95% efficiency and excellent powerdissipation capability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibilityand the feature-set of a discrete point-of-load design and is ideal for powering a wide range ofICs and systems. Advanced packaging technology affords a robust and reliable power solutioncompatible with standard QFN mounting and testing techniques.