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2.95V to 17V, 7A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package


Package | PIN: RVQ | 42
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $9.83
10-24 $9.14
25-99 $8.82
100-249 $7.70
250-499 $7.33
500-749 $6.75
750-999 $6.06
1000+ $6.04


  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 10 mm × 10 mm × 4.3 mm Package
    • Pin Compatible with LMZ31710 and LMZ31704
  • Efficiencies Up To 95%
  • Eco-mode™ / Light Load Efficiency (LLE)
  • Wide-Output Voltage Adjust
    0.6 V to 5.5 V, with 1% Reference Accuracy
  • Supports Parallel Operation for Higher Current
  • Optional Split Power Rail Allows
    Input Voltage Down to 2.95 V
  • Adjustable Switching Frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an External Clock
  • Provides 180° out-of-phase Clock Signal
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Over-Current & Over-Temperature Protection
  • Pre-Bias Output Start-Up
  • Operating Temperature Range: –40°C to +85°C
  • Enhanced Thermal Performance: 13.3°C/W
  • Meets EN55022 Class B Emissions
    • Integrated ShieldedInductor
  • Create a Custom Design Using the LMZ31707 With the WEBENCH® Power Designer

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Texas Instruments  LMZ31707RVQT

The LMZ31707 SIMPLE SWITCHER® power module is an easy-to-use integrated power solutionthat combines a 7-A DC-DC converter with power MOSFETs, a shielded inductor, and passives into alow profile, QFN package. This total power solution allows as few as three external components andeliminates the loop compensation and magnetics part selection process.

The 10×10×4.3 mm QFN package is easy to solder onto a printed circuit board and allows acompact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipationcapability with a thermal impedance of 13.3°C/W. The LMZ31707 offers the flexibility and thefeature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs andsystems. Advanced packaging technology affords a robust and reliable power solution compatible withstandard QFN mounting and testing techniques.