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2.95V to 17V, 10A Step-Down Power Module with Current Sharing in 10x10x4.3mm QFN Package


Package | PIN: RVQ | 42
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $11.70
10-24 $10.88
25-99 $10.50
100-249 $9.17
250-499 $8.73
500-749 $8.03
750-999 $7.21
1000+ $7.19


  • Complete Integrated Power Solution
    • Small Footprint, Low-Profile Design
    • Pin Compatible with LMZ31707 and LMZ31704
    • 10 mm × 10 mm ×4.3 mm Package
  • Efficiencies Up to 95%
  • Eco-Mode™ and Light Load Efficiency (LLE)
  • Wide-Output Voltage Adjust
    0.6 V to 5.5 V, With 1% Reference Accuracy
  • Supports Parallel Operation for Higher Current
  • Optional Split Power Rail Allows
    Input Voltage Down to 2.95 V
  • Adjustable Switching Frequency
    (200 kHz to 1.2 MHz)
  • Synchronizes to an External Clock
  • Provides 180° Out-of-Phase Clock Signal
  • Adjustable Slow Start
  • Output Voltage Sequencing and Tracking
  • Power-Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Overcurrent and Overtemperature Protection
  • Prebias Output Start-up
  • Operating Temperature Range: –40°C to +85°C
  • Enhanced Thermal Performance: 13.3°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design using the LMZ31710 with the WEBENCH® Power Designer

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Texas Instruments  LMZ31710RVQT

The LMZ31710 power module is an easy-to-use integrated power solution that combines a10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFNpackage. This total power solution allows as few as three external components and eliminates theloop compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board andallows a compact point-of-load design. The device achieves greater than 95% efficiency andexcellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offersthe flexibility and the feature set of a discrete point-of-load design and is ideal for powering awide range of ICs and systems. Advanced packaging technology affords a robust and reliable powersolution compatible with standard QFN mounting and testing techniques.