|Package | PIN:||HSOIC (DWP) | 20|
|Temp:||S (-40 to 125)|
- Qualified for Automotive Applications
- High Output Current: 1.5A
- Wide Power-Supply Range:
- Single Supply: +7V to +24V
- Dual Supply: ±3.5V to ±12V
- Large Output Swing: 20VPP at 1.5A
- Fully Protected:
- Thermal Shutdown
- Adjustable Current Limit
- Diagnostic Flags:
- Thermal Shutdown
- Output ENABLE/SHUTDOWN Control
- High Speed:
- Gain-Bandwidth Product: 17MHz
- Full-Power Bandwidth at 10VPP: 1.3MHz
- Slew Rate: 40V/µs
- Diode for Junction Temperature Monitoring
- HSOP-20 PowerPAD Package
(Bottom- and Top-Side Thermal Pad Versions)
- Powerline Communications
- Valve, Actuator Driver
- VCOM Driver
- Motor Driver
- Audio Power Amplifier
- Power-Supply Output Amplifier
- Test Equipment Amplifier
- Transducer Excitation
- Laser Diode Driver
- General-Purpose Linear Power Booster
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Texas Instruments OPA564AQDWPRQ1
The OPA564-Q1 is a low-cost, high-current operational amplifier that is ideal for driving up to 1.5A into reactive loads. The high slew rate provides 1.3MHz full-power bandwidth and excellent linearity. These monolithic integrated circuits provide high reliability in demanding powerline communications and motor control applications.
The OPA564-Q1 operates from a single supply of 7V to 24V, or dual power supplies of ±3.5V to ±12V. In single-supply operation, the input common-mode range extends to the negative supply. At maximum output current, a wide output swing provides a 20VPP (IOUT = 1.5A) capability with a nominal 24V supply.
The OPA564-Q1 is internally protected against over-temperature conditions and current overloads. It is designed to provide an accurate, user-selected current limit. Two flag outputs are provided; one indicates current limit and the second shows a thermal over-temperature condition. It also has an Enable/Shutdown pin that can be forced low to shut down the output, effectively disconnecting the load.
The OPA564-Q1 is housed in a thermally-enhanced, surface-mount PowerPAD™ package (HSOP-20) with the choice of the thermal pad on either the top side or the bottom side of the package.