|Package | PIN:||DGV | 56|
|Temp:||I (-40 to 85)|
- UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, Clocked, or Clock-Enabled Mode
- State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- High-Drive (-24/24 mA at 2.5-V and
-32/64 mA at 3.3-V VCC)
- Ioff and Power-Up 3-State Support Hot Insertion
- Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
- Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
- Flow-Through Architecture Facilitates Printed Circuit Board Layout
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package
NOTE: For tape and reel order entry:
The DGGR package is abbreviated to GR and
the DGVR package is abbreviated to VR.
UBT and Widebus are trademarks of Texas Instruments Incorporated.
Texas Instruments SN74ALVTH16601VR
The 'ALVTH16601 devices are 18-bit universal bus transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The devices combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB\ and CLKENBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. Output enable OEAB\ is active low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state.
Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, CLKBA, and CLKENBA\.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ALVTH16601 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16601 is characterized for operation from -40°C to 85°C.