SN74AUP1G240DBVR

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SN74AUP1G240DBVR

Low-Power Single Buffer/Driver with 3-State Output

Packaging

Package | PIN: DBV | 5
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $0.29
10-24 $0.26
25-99 $0.23
100-249 $0.20
250-499 $0.18
500-749 $0.14
750-999 $0.11
1000+ $0.09

Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    • ICC = 0.9 µA Maximum
  • Low Dynamic-Power Consumption
    • Cpd = 4.2 pF at 3.3 V Typical
  • Low Input Capacitance
    • CI = 1.5 pF Typical
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Input-Disable Feature Allows Floating Input Conditions
  • Ioff Supports Partial Power-Down-Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.7 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

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Texas Instruments  SN74AUP1G240DBVR

The AUP family is TI’s premier solution to the industry’s low power needs inbattery-powered portable applications. This family assures a very low static and dynamic powerconsumption across the entire VCC range of 0.8 V to 3.6 V, resulting in anincreased battery life. This product also maintains excellent signal integrity (seeAUP – The Lowest-Power Family ).

This buffer/driver is a single line driver with a 3-state output. The output is disabledwhen the output-enable (OE) input is high. This device has the input-disablefeature, which allows floating input signals.

To assure the high-impedance state during power up or power down,OE should be tied to VCC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of thedriver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using thedie as the package.

This device is fully specified for partial-power-down applications usingIoff. The Ioff circuitry disables the outputs whenthe device is powered down. This inhibits current backflow into the device which prevents damage tothe device.