SN74AUP2G126YFPR

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SN74AUP2G126YFPR

Low-Power Dual Bus Buffer Gate With 3-State Outputs

Packaging

Package | PIN: YFP | 8
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $0.59
10-24 $0.52
25-99 $0.47
100-249 $0.40
250-499 $0.37
500-749 $0.28
750-999 $0.22
1000+ $0.19

Features

  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption
    (Cpd = 4 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typ)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Input-Disable Feature Allows Floating Input Conditions
  • Ioff Supports Partial-Power-Down Mode Operation
  • Input Hysteresis Allows Slow Input Transition and
    Better Switching Noise Immunity at Input
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 9.9 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.

Texas Instruments  SN74AUP2G126YFPR

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

The SN74AUP2G126 is a dual bus driver/line driver with 3-state outputs, designed for 0.8-V to 3.6-V VCC operation. The outputs are disabled when the associated output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.