|Package | PIN:||DW | 20|
|Temp:||C (0 to 70)|
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
Texas Instruments SN74F240DWR
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F241 and ´F244, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.
The ´F240 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.
The SN74F240 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F240 is characterized for operation from 0°C to 70°C.