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SN74LVC1G11MDCKREP

Enhanced Product Single 3-Input Positive AND Gate

Packaging

Package | PIN: DCK | 6
Temp: M (-55 to 125)
Carrier: Cut Tape
Qty Price
1-9 $1.02
10-24 $0.91
25-99 $0.84
100-249 $0.72
250-499 $0.66
500-749 $0.54
750-999 $0.43
1000+ $0.39

Features

  • Available in the Texas Instruments NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.9 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

(1) Additional temperature ranges are available - contact factory

NanoFree Is a trademark of Texas Instruments.

Texas Instruments  SN74LVC1G11MDCKREP

The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.