SN74LVC1G27DBVR

text.skipToContent text.skipToNavigation

SN74LVC1G27DBVR

Single 3-Input Positive-NOR Gate

Packaging

Package | PIN: DBV | 6
Temp: Q (-40 to 125)
Carrier: Cut Tape
Qty Price
1-9 $0.22
10-24 $0.19
25-99 $0.17
100-249 $0.15
250-499 $0.13
500-749 $0.10
750-999 $0.08
1000+ $0.07

Features

  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Max tpd of 4.5 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Texas Instruments  SN74LVC1G27DBVR

The SN74LVC1G27 device performs the Boolean function Y = A + B + C or Y = A  •  B  •  C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.