SN74LVC1G99YZPR

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SN74LVC1G99YZPR

Ultra-Configurable Multi-Function Gate With 3-State Outputs

Packaging

Package | PIN: YZP | 8
Temp: Q (-40 to 125)
Carrier: Cut Tape
Qty Price
1-9 $0.62
10-24 $0.55
25-99 $0.50
100-249 $0.43
250-499 $0.39
500-749 $0.30
750-999 $0.23
1000+ $0.20

Features

  • Available in Texas Instruments
    NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Supports Down Translation to VCC
  • Max tpd of 6.7 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Offers Nine Different Logic Functions in a Single Package
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows for Slow Input Transition Time and Better Noise Immunity at Input
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Texas Instruments  SN74LVC1G99YZPR

The SN74LVC1G99 device is operational from 1.65 V to 5.5 V.

The SN74LVC1G99 device features configurable multiple functions with a 3-state output. The output is disabled when the output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input. The user can choose logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND.

This device functions as an independent inverter, but because of Schmitt action, it has different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoFree™ package technologies are a major breakthrough in IC packaging concepts, using the die as the package.