|Package | PIN:||DBV | 5|
|Temp:||I (-40 to 85)|
- Output Swing Includes Both Supply Rails
- Low Noise...15 nV/Hz\ Typ at f = 1 kHz
- Low Input Bias Current...1 pA Typ
- Fully Specified for Single-Supply 3-V and 5-V Operation
- Common-Mode Input Voltage Range Includes Negative Rail
- High Gain Bandwidth...2 MHz at
VDD = 5 V With 600- Load
- High Slew Rate...1.6 V/us at VDD = 5 V
- Wide Supply Voltage Range
2.7 V to 10 V
- Macromodel Included
Advanced LinCMOS is a trademark of Texas Instruments.
Texas Instruments TLV2231IDBVT
The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of bandwidth and 1.6 V/us of slew rate for applications requiring good ac performance. The device exhibits rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600- loads for telecom applications.
With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN- terminals are on the same end of the board for providing negative feedback. Finally, gain setting resistors and the decoupling capacitor are easily placed around the package.