TLV2324ID

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TLV2324ID

Quad Low-Voltage Micropower Operational Amplifier

Packaging

Package | PIN: D | 14
Temp: I (-40 to 85)
Carrier: Partial Tube
Qty Price
1-9 $3.12
10-24 $2.81
25-99 $2.61
100-249 $2.29
250-499 $2.15
500-749 $1.83
750-999 $1.54
1000+ $1.47

Features

  • Wide Range of Supply Voltages Over Specified Temperature Range:
  • TA = -40°C to 85°C...2 V to 8 V
  • Fully Characterized at 3 V and 5 V
  • Single-Supply Operation
  • Common-Mode Input Voltage Range
    Extends Below the Negative Rail and up to
    VDD -1 V at TA = 25°C
  • Output Voltage Range Includes Negative Rail
  • High Input Impedance...1012 Typical
  • ESD-Protection Circuitry
  • Designed-In Latch-Up Immunity

LinCMOS is a trademark of Texas Instruments Incorporated.

Texas Instruments  TLV2324ID

The TLV232x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. This amplifier is especially well suited to ultra-low-power systems that require devices to consume the absolute minimum of supply currents. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input voltage range includes the negative rail and extends to within 1 V of the positive rail.

These amplifiers are specifically targeted for use in very low-power, portable, battery-driven applications with the maximum supply current per operational amplifier specified at only 27 uA over its full temperature range of -40°C to 85°C.

Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.

To facilitate the design of small portable equipment, the TLV232x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.

The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV232x incorporates internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD can result in the degradation of the device parametric performance.