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TLV2342ID

Dual LinCMOS™ Low-Voltage High-Speed Operational Amplifier

Packaging

Package | PIN: D | 8
Temp: I (-40 to 85)
Carrier: Partial Tube
Qty Price
1-9 $3.53
10-24 $3.18
25-99 $2.96
100-249 $2.60
250-499 $2.43
500-749 $2.07
750-999 $1.75
1000+ $1.67

Features

  • Wide Range of Supply Voltages Over Specified Temperature Range:
  • -40°C to 85°C...2 V to 8 V
  • Fully Characterized at 3 V and 5 V
  • Single-Supply Operation
  • Common-Mode Input-Voltage Range Extends Below the Negative Rail and Up to VDD -1 V at 25°C
  • Output Voltage Range Includes Negative Rail
  • High Input Impedance...1012 Typical
  • ESD-Protection Circuitry
  • Designed-In Latch-Up Immunity
  • LinCMOS is a trademark of Texas Instruments Incorporated.

Texas Instruments  TLV2342ID

The TLV234x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike other products in this family designed primarily to meet aggressive power consumption specifications, the TLV234x was developed to offer ac performance approaching that of a BiFET operational amplifier while operating from a single-supply rail. At 3 V, the TLV234x has a typical slew rate of 2.1 V/us and 790-kHz unity-gain bandwidth.

Each amplifier is fully functional down to a minimum supply voltage of 2 V and is fully characterized, tested, and specified at both 3-V and 5-V power supplies over a temperature range of -40°C to 85°C. The common-mode input voltage range includes the negative rail and extends to within 1 V of the positive rail.

Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low input bias currents. These parameters combined with good ac performance make the TLV234x effectual in applications such as high-frequency filters and wide-bandwidth sensors.

To facilitate the design of small portable equipment, the TLV234x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.

The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV234x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-PRF-38535, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.