TLV5610IYZR

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TLV5610IYZR

2.7V to 5.5V, 12-Bit Octal DAC in Wafer Chip Scale Package

Packaging

Package | PIN: YZ | 20
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $16.72
10-24 $15.55
25-99 $15.01
100-249 $13.11
250-499 $12.48
500-749 $11.48
750-999 $10.31
1000+ $10.27

Features

  • Eight, 12-Bit, Voltage Output DACs in One Package
  • Pin-Compatible, Pb-Free, RoHS-Compliant Upgrade to the TLV5610IYE
  • Programmable Settling Time versus PowerConsumption:
    • 1µs in Fast Mode
    • 3µs in Slow Mode
  • Compatible With TMS320™ DSP Family and SPI™ Serial Ports
  • Differential and Single-Ended Analog Input/Output
  • Separate Software Control for ADC and DAC Power Down
  • Monotonic Over Temperature
  • Low Power Consumption:
    • 18mW in Slow Mode at 3V
    • 48mW in Fast Mode at 3V
  • Power Down Mode
  • Buffered, High-Impedance Reference Inputs
  • Data Output for Daisy-Chaining
  • APPLICATIONS
    • Digital Servo-Control Loops
    • Digital Offset and Gain Adjustment
    • Industrial Process Control
    • Machine and Motion Control Devices
    • Mass Storage Devices

TMS320 is a trademark of Texas Instruments, Inc.
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corp.
All other trademarks are the property of their respective owners.

Texas Instruments  TLV5610IYZR

The TLV5610IYZ is the lead-free version of the TLV5610IYE, an eight-channel, 12-bit, voltage output digital-to-analog converter (DAC) with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI™, and Microwire™ serial ports. It is programmed with a 16-bit serial string containing four control and 12 data bits.

Additional features include a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output that can be used to cascade multiple devices.

The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed versus power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage.

The TLV5610IYZ is implemented in a CMOS process and is available in a 20-terminal wafer chip-scale package (WCSP). The TLV5610IYZ is characterized for operation from -40°C to +85°C in a wire-bonded small outline (SO) package.