TPA4411RTJT

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TPA4411RTJT

80-mW DirectPath™ Stereo Headphone Amplifier

Packaging

Package | PIN: RTJ | 20
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $1.58
10-24 $1.42
25-99 $1.32
100-249 $1.15
250-499 $1.06
500-749 $0.89
750-999 $0.73
1000+ $0.67

Features

  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs

Texas Instruments  TPA4411RTJT

The TPA4411 and TPA4411M are stereo headphone drivers designed to allowthe removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.