TPA6130A2YZHT

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TPA6130A2YZHT

138-mW DirectPath™ Stereo Headphone Amplifier with I2C Volume Control (TPA6130)

Packaging

Package | PIN: YZH | 16
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $1.38
10-24 $1.25
25-99 $1.16
100-249 $1.02
250-499 $0.95
500-749 $0.81
750-999 $0.68
1000+ $0.65

Features

  • DirectPath™ Ground-Referenced Outputs
    • Eliminates Output DC Blocking Capacitors
    • Reduces Board Area
    • Reduces Component Height and Cost
    • Full Bass Response Without Attenuation
  • Power Supply Voltage Range: 2.5 V to 5.5 V
  • 64 Step Audio Taper Volume Control
  • High Power Supply Rejection Ratio
    (>100 dB PSRR)
  • Differential Inputs for Maximum Noise Rejection
    (68 dB CMRR)
  • High-Impedance Outputs When Disabled
  • Advanced Pop and Click Suppression Circuitry
  • Digital I2C Bus Control
    • Per Channel Mute and Enable
    • Software Shutdown
    • Multi-Mode Support: Stereo HP, Dual Mono
      HP, and Single-Channel BTL Operation
    • Amplifier Status
  • Space Saving Packages
    • 20 Pin, 4 mm × 4 mm QFN
    • 16 ball, 2 mm × 2 mm DSBGA
  • ESD Protection of 8 kV HBM and IEC Contact

Texas Instruments  TPA6130A2YZHT

The TPA6130A2 is a stereo DirectPath™ headphone amplifier with I2C digital volume control. The TPA6130A2 has minimal quiescent current consumption, with a typical IDD of 4 mA, making it optimal for portable applications. The I2C control allows maximum flexibility with a 64 step audio taper volume control, channel independent enables and mutes, and the ability to configure the outputs into stereo, dual mono, or a single receiver speaker BTL amplifier that drives 300 mW of power into 16 Ω loads.

The TPA6130A2 is a high fidelity amplifier with an SNR of 98 dB. A PSRR greater than 100 dB enables direct-to-battery connections without compromising the listening experience. The output noise of 9 µVrms (typical A-weighted) provides a minimal noise background during periods of silence. Configurable differential inputs and high CMRR allow for maximum noise rejection in the noisy environment of a mobile device.

TPA6130A2 packaging includes a 2 by 2 mm chip-scale package, and a 4 by 4 mm QFN package.