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Automotive 3.5V to 28V, 300kHz Fixed Frequency 2A Buck Converter with Eco-Mode™


Package | PIN: D | 8
Temp: Q (-40 to 125)
Carrier: Cut Tape
Qty Price
1-9 $3.35
10-24 $3.02
25-99 $2.81
100-249 $2.46
250-499 $2.31
500-749 $1.96
750-999 $1.65
1000+ $1.58


  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade1: –40°C to +125°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C3B
  • 3.5 V to 28 V Input Voltage Range
  • Adjustable Output Voltage Down to 0.8 V
  • Integrated 80-mΩ High-Side MOSFET Supports
    up to 2-A Continuous Output Current
  • High Efficiency at Light Loads With a Pulse-Skipping Eco-mode
  • Fixed 300-kHz Switching Frequency
  • Typical 1 µA Shutdown Quiescent Current
  • Adjustable Slow Start Limits Inrush Currents
  • Programmable UVLO Threshold
  • Overvoltage Transient Protection
  • Cycle by Cycle Current Limit, Frequency Fold Back and
    Thermal Shutdown Protection
  • Available in the SOIC8 Package
  • Supported by SwitcherPro Software Tool

Texas Instruments  TPS54233QDRQ1

The TPS54233-Q1 is a 28 V, 2 A non-synchronous buck converter that integrates a low RDS(on) high side MOSFET. To increase efficiency at light loads, a pulse skipping Eco-mode™ feature is automatically activated. Furthermore, the 1 µA shutdown supply current allows the device to be used in battery powered applications. Current mode control with internal slope compensation simplifies the external compensation calculations and reduces component count while allowing the use of ceramic output capacitors. A resistor divider programs the Hysteresis of the input under-voltage lockout. An overvoltage transient protection circuit limits voltage overshoots during startup and transient conditions. A cycle by cycle current limit scheme, frequency fold back and thermal shutdown protect the device and the load in the event of an overload condition. The TPS54233-Q1 is available in an 8-pin SOIC package that has been internally optimized to improve thermal performance.