TPS63011YFFR

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TPS63011YFFR

High Efficient Single Inductor Buck-Boost Converter with 2-A Switches

Packaging

Package | PIN: YFF | 20
Temp: I (-40 to 85)
Carrier: Cut Tape
Qty Price
1-9 $1.82
10-24 $1.64
25-99 $1.53
100-249 $1.34
250-499 $1.26
500-749 $1.07
750-999 $0.90
1000+ $0.86

Features

  • Up to 96% Efficiency
  • 1200-mA Output Current at 3.3 V in Step-Down
    Mode (VIN = 3.6 V to 5.5 V)
  • Up to 800-mA Output Current at 3.3 V in Boost
    Mode (VIN > 2.4 V)
  • Automatic Transition Between Step-Down and
    Boost Mode
  • Device Quiescent Current less than 50 µA
  • Input Voltage Range: 2 V to 5.5 V
  • Fixed and Adjustable Output Voltage Options
    from 1.2 V to 5.5 V
  • Power Save Mode for Improved Efficiency at
    Low-Output Power
  • Forced Fixed Frequency Operation and
    Synchronization Possible
  • Load Disconnect During Shutdown
  • Output Overvoltage Protection
  • Overtemperature Protection
  • Available in Small 20-Pin, 2.126 mm ×
    1.922 mm, DSBGA Package

Texas Instruments  TPS63011YFFR

The TPS6301x devices provide a power supply solution for products powered by either a two-cell or three-cell alkaline, NiCd or NiMH battery, or a one-cell Li-Ion or Li-polymer battery. Output currents can go as high as 1200 mA while using a single-cell Li-Ion or Li-Polymer Battery, and discharge it down to 2.5 V or lower. The buck-boost converter is based on a fixed-frequency, pulse-width-modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. At low load currents, the converter enters power save mode to maintain high efficiency over a wide load current range. The power save mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value of 2200 mA. The output voltage is programmable using an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is disconnected from the battery. The device is packaged in a 20-pin DSBGA package measuring 2.126 mm × 1.922 mm (YFF).