484-pin (ZER) package image

AM3505AZERA 正在供货

Sitara 处理器: Arm Cortex-A8、视频前端

定价

数量 价格
+

质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 SNAGCU
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
查看

出口管制分类

*仅供参考

  • 美国 ECCN:3A991A2

封装信息

封装 | 引脚 BGA (ZER) | 484
工作温度范围 (°C) -40 to 105
包装数量 | 包装 60 | JEDEC TRAY (5+1)

AM3505 的特性

  • AM3517/05 Sitara Processor:
    • MPU Subsystem
      • 600-MHz Sitara ARM Cortex-A8 Core
      • NEON SIMD Coprocessor and Vector
        Floating-Point (FP) Coprocessor
    • Memory Interfaces:
      • 166-MHz 16- and 32-Bit mDDR/DDR2
        Interface with 1GB of Total Addressable
        Space
      • Up to 83 MHz General-Purpose Memory
        Interface Supporting 16-Bit-Wide
        Multiplexed Address/DataBus
      • 64KB of SRAM
      • 3 Removable Media Interfaces
        [MMC/SD/SDIO]
    • IO Voltage:
      • mDDR/DDR2 IOs: 1.8V
      • Other IOs: 1.8V and 3.3V
    • Core Voltage: 1.2V
    • Commercial and Extended Temperature Grade
      (operating restrictions apply)
    • 16-Bit Video Input Port Capable of
      Capturing HD Video
    • HD Resolution Display Subsystem
    • Serial Communication
      • High-End CAN Controller
      • 10/100 Mbit Ethernet MAC
      • USB OTG Subsystem with Standard
        DP/DM Interface [HS/FS/LS]
      • Multiport USB Host Subsystem [HS/FS/LS]
        • 12-Pin ULPI or 6-, 4-, or 3-Pin Serial
          Interface
      • Four Master and Slave Multichannel Serial
        Port Interface(McSPI) Ports
      • Five Multichannel Buffered Serial Ports (McBSPs)
        • 512-Byte Transmit and Receive Buffer
          (McBSP1/3/4/5)
        • 5-KB Transmit and Receive Buffer (McBSP2)
        • SIDETONE Core Support (McBSP2 and
          McBSP3 Only)For Filter, Gain, and Mix
          Operations
        • 128-Channel Transmit and Receive Mode
        • Direct Interface to I2S and PCM Device and
          TDM Buses
      • HDQ/1-Wire Interface
      • 4 UARTs (One with Infrared Data Association
        [IrDA] and Consumer Infrared [CIR] Modes)
      • 3 Master and Slave High-Speed Inter-Integrated
        Circuit (I2C) Controllers
      • Twelve 32-bit General-Purpose Timers
      • One 32-bit Watchdog Timer
      • One 32-bit 32-kHz Sync Timer
      • Up to 186 General-Purpose I/O (GPIO) Pins
  • Display Subsystem
    • Parallel Digital Output
    • Up to 24-Bit RGB
    • Supports Up to 2 LCD Panels
    • Support for Remote Frame Buffer Interface (RFBI)
      LCD Panels
    • Two 10-Bit Digital-to-Analog Converters (DACs)
      Supporting
      • Composite NTSC/PAL Video
      • Luma/Chroma Separate Video (S-Video)
    • Rotation of 90, 180, and 270 Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Video Processing Front End (VPFE) 16-Bit Video Input Port
    • RAW Data Interface
    • 75-MHz Maximum Pixel Clock
    • Supports REC656/CCIR656 Standard
    • Supports YCbCr422 Format (8-Bit or 16-Bit with Discrete
      Horizontal and Vertical Sync Signals)
    • Generates Optical Black Clamping Signals
    • Built-in Digital Clamping and Black Level Compensation
    • 10-Bit to 8-Bit A-law Compression Hardware
    • Supports up to 16K Pixels (Image Size) in Horizontal
      and Vertical Directions
  • System Direct Memory Access (sDMA) Controller (32 Logical
    Channels with Configurable Priority)
  • Comprehensive Power, Reset, and Clock Management
  • ARM Cortex-A8 Memory Architecture
    • ARMv7 Architecture
      • In-Order, Dual-Issue, Superscalar Microprocessor Core
      • ARM NEON Multimedia Architecture
      • Over 2x Performance of ARMv6 SIMD
      • Supports Both Integer and Floating-Point SIMD
      • Jazelle RCT Execution Environment Architecture
      • Dynamic Branch Prediction with Branch Target Address
        Cache, Global History Buffer and 8-Entry Return Stack
      • Embedded Trace Macrocell [ETM] Support for
        Noninvasive Debug
      • 16KB of Instruction Cache (4-Way Set-Associative)
      • 16KB of Data Cache (4-Way Set-Associative)
      • 256KB of L2 Cache
    • PowerVR SGX Graphics Accelerator (AM3517 Only)
      • Tile-Based Architecture Delivering up to 10 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine
        Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and
        2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and
        Power Management
      • Programmable, High-Quality Image Anti-Aliasing
    • Endianess
      • ARM Instructions – Little Endian
      • ARM Data – Configurable
    • SDRC Memory Controller
      • 16- and 32-Bit Memory Controller with 1GB of
        Total Address Space
      • Double Data Rate (DDR2) SDRAM, Mobile Double Data Rate
        (mDDR)SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address/Data Bus
      • Up to 8 Chip-Select Pins with 128MB of Address
        Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC
        Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface
        to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address/Data Mode (Limited 2-KB
        Address Space)
    • Test Interfaces
      • IEEE-1149.1 (JTAG) Boundary-Scan Compatible
      • Embedded Trace Macro Interface (ETM)
    • 65-nm CMOS Technology
    • Packages:
      • 491-Pin BGA (17 x 17, 0.65-mm Pitch)
        [ZCN Suffix]
        with Via Channel Array
        Technology
      • 484-Pin PBGA (23 x 23, 1-mm Pitch)
        [ZER Suffix]

    AM3505 的说明

    AM3517/05 is a high-performance ARM Cortex-A8 microprocessor with speeds up to 600 MHz. The device offers 3D graphics acceleration while also supporting numerous peripherals, including DDR2, CAN, EMAC, and USB OTG PHY that are well suited for industrial apllications.

    The processor can support other applications, including: Single-board computers Home and industrial automation Human machine Interface

    The device supports high-level operating systems (OSs), such as:

    • Linux®
    • Windows® CE
    • Android™

    The following subsystems are part of the device:

    • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
    • PowerVR SGX graphics accelerator (AM3517 device only) subsystem for 3D graphics acceleration to support display and gaming effects
    • Display subsystem with several features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
    • High-performance interconnects provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals. The device also offers a comprehensive clock-management scheme.

    AM3517/05 devices are available in a 491-pin BGA package and a 484-pin PBGA package.

    This AM3517/05 data manual presents the electrical and mechanical specifications for the AM3517/05 Sitara processor.

    定价

    数量 价格
    +

    包装方式

    您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

    定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

    剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

    TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

    了解更多信息

    可提供批次和生产日期代码选项

    您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

    了解更多信息